Mechanism of Anodic Dissolution Facilitating Ambient Creep of Brass

Gu Biao; Chu Wei; Chu Wuyang; Qiao Lijie; Xiao Jimei

doi:10.13374/j.issn1001-053x.1995.05.014

Volume 17 Issue 5

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Article Navigation > Chinese Journal of Engineering > 1995 > 17(5): 469-471,475

Gu Biao, Chu Wei, Chu Wuyang, Qiao Lijie, Xiao Jimei. Mechanism of Anodic Dissolution Facilitating Ambient Creep of Brass[J]. Chinese Journal of Engineering, 1995, 17(5): 469-471,475. doi: 10.13374/j.issn1001-053x.1995.05.014

Citation:

Gu Biao, Chu Wei, Chu Wuyang, Qiao Lijie, Xiao Jimei. Mechanism of Anodic Dissolution Facilitating Ambient Creep of Brass[J]. Chinese Journal of Engineering, 1995, 17(5): 469-471,475. doi: 10.13374/j.issn1001-053x.1995.05.014

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Mechanism of Anodic Dissolution Facilitating Ambient Creep of Brass

doi: 10.13374/j.issn1001-053x.1995.05.014

Department of Materials Physics, USTB, Beijing 100083, PRC

Received Date: 1994-11-25
Available Online: 2021-09-06

Abstract

Abstract

The creep rate resulting from dislocation climb induced by vacancy supereaturation during the anodic polarization has been calculated.The results showed that the creep rate in both solutions increased linearly with the increase of the anodic current density and was approximately inversely proportional to the radius of the specimen and related to the degree of de-alloying.The experimental data supported the proposed mechanism.
- electrochemical dissolution,
- supersaturation vacancies,
- brass/ambient creep,
- dislocation climb