Citation: | JIANG Guan-zhao, WU Ai-xiang, WANG Yi-ming, WANG Hong-jiang, LAN Wen-tao, LIU Chao. Effect of compound activator on copper slag activity and preparation of filling materials[J]. Chinese Journal of Engineering, 2017, 39(9): 1305-1312. doi: 10.13374/j.issn2095-9389.2017.09.002 |
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