MA Yun-zhu, CUI Peng, LIU Wen-sheng, PENG Fen, HUANG Guo-ji. Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation[J]. Chinese Journal of Engineering, 2011, 33(2): 188-192. doi: 10.13374/j.issn1001-053x.2011.02.010
Citation:
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MA Yun-zhu, CUI Peng, LIU Wen-sheng, PENG Fen, HUANG Guo-ji. Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation[J]. Chinese Journal of Engineering, 2011, 33(2): 188-192. doi: 10.13374/j.issn1001-053x.2011.02.010
|
MA Yun-zhu, CUI Peng, LIU Wen-sheng, PENG Fen, HUANG Guo-ji. Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation[J]. Chinese Journal of Engineering, 2011, 33(2): 188-192. doi: 10.13374/j.issn1001-053x.2011.02.010
Citation:
|
MA Yun-zhu, CUI Peng, LIU Wen-sheng, PENG Fen, HUANG Guo-ji. Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation[J]. Chinese Journal of Engineering, 2011, 33(2): 188-192. doi: 10.13374/j.issn1001-053x.2011.02.010
|
Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation
- Received Date: 2010-03-30
Available Online:
2021-07-30