Deformation characteristic and interface microstructure of TA1/Q235 during accumulative roll-bonding

The deformation characteristic and interface microstructure of TA1/Q235 during deformation process were studied with accumulative roll-bonding (ARB) technology. It was found that the difference of deformation between TA1 and Q235 enlarged with increasing total strain. When the true strain exceeded 1.0, the difference kept about 1.0. An abrupt change point of the TA1 ' s strain was observed between 850℃ and 900℃, and rose with increasing the difference of radial deformation. When the deformation temperature was less than 850 ℃, obvious deformation microstructure appeared on the side of Q235, which was vertical to the compression direction. When the deformation temperature is between 850℃ and 900℃, obvious ferrite columnar grains were found. The ferrite columnar grains regularly arranged on the side of Q235, and nearly all of them were vertical to the interface. As the temperature increased, the ferrite grains became coarsening. Under the condition of the cumulative deformation less than 1.5 and the deformation temperature of 850℃, the thickness of intermetallic compounds was 0.7 to 1 μm ; when the cumulative deformation increased to 2.0, its thickness was about 1.7 μm. When the cumulative deformation was 1.0 and the deformation temperature is between 700℃and 850 ℃, the thickness of interface compounds was 0.8 to 1 μm. But when the deformation temperature was 900℃ the thickness increased more than one time, and was 2.3 μm when the deformation temperature is 950℃.