Fabrication of the electronic package box preform of SiCp/Al composites by powder injection molding

Suitable feedstock was obtained after analyzing the rheological properties of silicon carbide ceramics. SiCp package box performs used in pressure infiltration experiment were manufactured through powder injection molding and debinding-pre-sintering process. Experimental results showed that the feedstork with 65% SiCp load and 70% PW (paraffin wax) + 29% HPDE (high-density polyethylene) + 1% SA (stearic acid) had the best injection properties in the wide ranges of temperature and shear rate. The injection part with no defects could be manufactured at suitable injection parameters. The debinder was successfully removed from the injection part by solvent and thermal debinding process. SiCp package box preforms with good appearance, enough strength and proper porosity were obtained by pre-sintering process at 1 150℃, which was up to the request of following pressure infiltration experiment to fabricate SiCp/Al composites package boxes.