Factors influencing the combined performance of hot-rolled bimetallic composite plates prepared <i>via</i> hot compression

QIN Qin; DENG Jun-chao; ZANG Yong; XIE Lu; ZHU Xue-hui

doi:10.13374/j.issn2095-9389.2018.04.010

Volume 40 Issue 4

Apr. 2018

Turn off MathJax

Article Contents

Article Navigation > Chinese Journal of Engineering > 2018 > 40(4): 469-477

QIN Qin, DENG Jun-chao, ZANG Yong, XIE Lu, ZHU Xue-hui. Factors influencing the combined performance of hot-rolled bimetallic composite plates prepared via hot compression[J]. Chinese Journal of Engineering, 2018, 40(4): 469-477. doi: 10.13374/j.issn2095-9389.2018.04.010

Citation:

QIN Qin, DENG Jun-chao, ZANG Yong, XIE Lu, ZHU Xue-hui. Factors influencing the combined performance of hot-rolled bimetallic composite plates prepared via hot compression[J]. Chinese Journal of Engineering, 2018, 40(4): 469-477. doi: 10.13374/j.issn2095-9389.2018.04.010

Citation:

PDF( 930 KB)

Factors influencing the combined performance of hot-rolled bimetallic composite plates prepared via hot compression

doi: 10.13374/j.issn2095-9389.2018.04.010

School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China

Received Date: 2018-01-18

Abstract

Abstract

Hot-rolled bimetallic composite plates are widely used because of their excellent properties. In the recent years, the enhancement of the combined performance of hot-rolled bimetallic composite plates has gained the attention of the industry. The molecular dynamics simulations were employed to assess the high-temperature combined performance of 316L/Q345R bimetallic plate systematically. The hot-compression process of the 316L/Q345R system was simulated on its atom structure model. The potential functions of the embedded-atom method were employed to describe the interaction between Fe, Cr, and Ni. The effects of temperature and compressive strain rate on the mechanism of the hot-compression deformation and the thickness of the diffusion layer were analyzed. The influence of adding a metal layer on the interface bonding performance was also discussed. The results show that increasing the temperature up to the composite melting point leads to the formation of a thicker diffusion layer at the bimetallic interface. However, an increase in the strain rate reduces the thickness of the diffusion layer, because the diffusion and compression time of the atoms shortens as the strain rate increases. The influence of the addition of a Ni or a Cr layer on the combined performance was investigated. The thickness of the diffusion layer of the bimetallic interface was increased by 134.5% when a lattice thickness Ni layer was added in the bimetallic interface; however, the addition of a Cr layer did not improve the combined performance. This study provides new insight into the factors that directly influence the performance of hot-rolled bimetallic composite plates.
- composite board,
- interface,
- combined performance,
- molecular dynamics,
- hot compression

FullText(HTML)

References(19)

References

[5]	Peng X K, Wuhrer R, Heness G, et al. Rolling strain effects on the interlaminar properties of roll bonded copper/aluminium metal laminates. J Mater Sci, 2000, 35(17):4357
[8]	Cao Q D, Li C Y, Chen F, et al. Reverse reduction ratio effect on the bonding strength of 7075 Al/AZ31B Mg/7075 Al laminated composite fabricated by hot rolling//Proceedings of the 2015 International Conference on Material Science and Applications (ICMSA 2015). Suzhou, 2015:449
[12]	Ren J W, Li Y J, Feng T. Microstructure characteristics in the interface zone of Ti/Al diffusion bonding. Mater Lett, 2002, 56(5):647
[13]	Nezhad M S A, Ardakani A H. A study of joint quality of aluminum and low carbon steel strips by warm rolling. Mater Des, 2009, 30(4):1103
[15]	Manesh D, Taheri K. An investigation of deformation behavior and bonding strength of bimetal strip during rolling. Mech Mater, 2005, 37(5):531
[19]	Zhang X P, Tan M J, Yang T H, et al. Isothermal rolling of Mgbased laminated composites made by explosion cladding. Key Eng Mater, 2010, 443:614
[21]	Gall K, Horstemeyer M F, Van Schilfgaarde M, et al. Atomistic simulations on the tensile debonding of an aluminum-silicon interface. J Mech Phys Solids, 2000, 48(10):2183
[22]	Bachlechner M E, Zhang J, Wang Y, et al. Molecular dynamics simulations of the mechanical strength of Si/Si₃N₄ interfaces. Phys Rev B, 2005, 72(9):094115
[23]	Benedek R, Alavi A, Seidman D N, et al. First principles simulation of a ceramic/metal interface with misfit. Phys Rev Lett, 2000, 84(15):3362
[24]	Chen S Y, Wu Z W, Liu K X, et al. Atomic diffusion behavior in Cu-Al explosive welding process. J Appl Phys, 2013, 113(4):044901
[25]	Luo M Z, Liang L, Lang L, et al. Molecular dynamics simulations of the characteristics of Mo/Ti interfaces. Comput Mater Sci, 2018, 141:293
[27]	Chen S D, Ke F J, Zhou M, et al. Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al. Acta Mater, 2007, 55(9):3169
[29]	Chen S D, Soh A K, Ke F J. Molecular dynamics modeling of diffusion bonding. Scripta Mater, 2005, 52(11):1135
[30]	Liu Y N, Chen Y Q, Yang C H. A study on atomic diffusion behaviours in an Al-Mg compound casting process. AIP Adv, 2015, 5(8):087147
[31]	Plimpton S. Fast parallel algorithms for short-range molecular dynamics. J Comput Phys, 1995, 117(1):1
[32]	Stukowski A. Visualization and analysis of atomistic simulation data with OVITO-the open visualization tool. Modell Simul Mater Sci Eng, 2009, 18(1):015012
[33]	Bagayoko D, Callaway J. Lattice-parameter dependence of ferromagnetism in bcc and fcc iron. Phys Rev B, 1983, 28(10):5419
[34]	Verlet L. Computer"experiments"on classical fluids. I. thermodynamical properties of Lennard-Jones molecules. Phys Rev, 1967, 159(1):98
[36]	Li J, Fang Q H, Liu B, et al. Mechanical behaviors of AlCrFeCuNi high-entropy alloys under uniaxial tension via molecular dynamics simulation. RSC Adv, 2016, 6(80):76409