WANG Rong-shan, HOU Huai-yu, CHEN Guo-liang. Molecular dynamics simulation of liquid Cu during isothermal solidification[J]. Chinese Journal of Engineering, 2009, 31(9): 1127-1131. doi: 10.13374/j.issn1001-053x.2009.09.006
Citation:
|
WANG Rong-shan, HOU Huai-yu, CHEN Guo-liang. Molecular dynamics simulation of liquid Cu during isothermal solidification[J]. Chinese Journal of Engineering, 2009, 31(9): 1127-1131. doi: 10.13374/j.issn1001-053x.2009.09.006
|
WANG Rong-shan, HOU Huai-yu, CHEN Guo-liang. Molecular dynamics simulation of liquid Cu during isothermal solidification[J]. Chinese Journal of Engineering, 2009, 31(9): 1127-1131. doi: 10.13374/j.issn1001-053x.2009.09.006
Citation:
|
WANG Rong-shan, HOU Huai-yu, CHEN Guo-liang. Molecular dynamics simulation of liquid Cu during isothermal solidification[J]. Chinese Journal of Engineering, 2009, 31(9): 1127-1131. doi: 10.13374/j.issn1001-053x.2009.09.006
|
Molecular dynamics simulation of liquid Cu during isothermal solidification
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1. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China;
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2. Suzhou Nuclear Power Research Institute Co. Ltd., Suzhou 215004, China;
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3. Department of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
- Received Date: 2008-09-19
Available Online:
2021-08-09