Dynamic Simulations of Element Mutual Diffusion during Hot Isostatic Pressing Diffusion Bonding

DONG Jianxin; HE Dong; ZHANG Maicang; CENG Yanping

doi:10.13374/j.issn1001-053x.2003.01.011

Volume 25 Issue 1

Aug. 2021

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DONG Jianxin, HE Dong, ZHANG Maicang, CENG Yanping. Dynamic Simulations of Element Mutual Diffusion during Hot Isostatic Pressing Diffusion Bonding[J]. Chinese Journal of Engineering, 2003, 25(1): 36-39. doi: 10.13374/j.issn1001-053x.2003.01.011

Citation:

DONG Jianxin, HE Dong, ZHANG Maicang, CENG Yanping. Dynamic Simulations of Element Mutual Diffusion during Hot Isostatic Pressing Diffusion Bonding[J]. Chinese Journal of Engineering, 2003, 25(1): 36-39. doi: 10.13374/j.issn1001-053x.2003.01.011

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Dynamic Simulations of Element Mutual Diffusion during Hot Isostatic Pressing Diffusion Bonding

doi: 10.13374/j.issn1001-053x.2003.01.011

Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China

Received Date: 2001-12-25
Available Online: 2021-08-17

Abstract

Abstract

Element mutual diffusions during hot iso-static pressing (HIP) diffusion bonding were simulated using DICRTRA-THERMO-CALC software. The calculating results show that the simulation regulations are agreeable with experimental results. Based on this simulation model, the effect of hold time and temperature on Al mutual diffusion during HIP were calculated, showing that this dynamic computer simulation can offer the processing prediction and the optimum HIP diffusion bonding processing.
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