Microstructure and Defect of Cu-Cr Alloy during Continuous Unidirectional Solidification

WANG Zidong; LIU Xing; WANG Guiqing; WU Chunjing; XIE Jianxin; WENG Min

doi:10.13374/j.issn1001-053x.2000.06.015

Volume 22 Issue 6

Aug. 2021

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Article Navigation > Chinese Journal of Engineering > 2000 > 22(6): 543-546

WANG Zidong, LIU Xing, WANG Guiqing, WU Chunjing, XIE Jianxin, WENG Min. Microstructure and Defect of Cu-Cr Alloy during Continuous Unidirectional Solidification[J]. Chinese Journal of Engineering, 2000, 22(6): 543-546. doi: 10.13374/j.issn1001-053x.2000.06.015

Citation:

WANG Zidong, LIU Xing, WANG Guiqing, WU Chunjing, XIE Jianxin, WENG Min. Microstructure and Defect of Cu-Cr Alloy during Continuous Unidirectional Solidification[J]. Chinese Journal of Engineering, 2000, 22(6): 543-546. doi: 10.13374/j.issn1001-053x.2000.06.015

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Microstructure and Defect of Cu-Cr Alloy during Continuous Unidirectional Solidification

doi: 10.13374/j.issn1001-053x.2000.06.015

1. Material Science and Engineering School, UST Beijing, Beijing 100083, China;
2. International Public Bidding of Technology and Equipment Corporation, Hang Zhou 310003, China

Received Date: 2000-01-04
Available Online: 2021-08-27

Abstract

Abstract

The match relationship among technological conditions of Cu-Cr alloy, during continuous unidirectional solidification has been studied. Microstructure of Cu-Cr alloy and the reason for formation of surface defect in Cu-Cr alloy have been analyzed. The best technological conditions are:height of mold is 10-25 mm, cooling distance is 25 mm, melting temperature of Cu-Cr alloy is 1 280℃, Withdrawal speed is 0.24-1.00 mm/s, amount of cooling water is 720 L/h.
- continuous unidirectional solidification,
- Cu-Cr alloy,
- microstructure