An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements

Hu Maopu; Luan Benli

doi:10.13374/j.issn1001-053x.1991.02.012

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Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. doi: 10.13374/j.issn1001-053x.1991.02.012

Citation:

Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. doi: 10.13374/j.issn1001-053x.1991.02.012

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An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements

doi: 10.13374/j.issn1001-053x.1991.02.012

Department of Surface Science and corrosion

Received Date: 1990-12-09
Available Online: 2021-10-23

Abstract

Abstract

The Model 368 system was used to measure the AC impedance of the process of electroless nickel plating. One inductive loop is found at low frequencies. A theoretical model including the step of adsorption of H₂PO₂^- ions is established based on the AC impedance measurements.
- electroless nickel plating,
- electrochemical mechanism,
- AC impedance measurement