THE INVESTIGATIONS OF THE KINETICS ON INTERMETALLIC COMPOUND GROWTH AT THE INTERFACE OF THE SUBSTRTE COPPER AND TIN OR TIN-LEAD COATING AND THE SOLDERABILITY

Lu Yongkui; Wang Baojue; Liu Jixiang

doi:10.13374/j.issn1001-053x.1985.04.011

Volume 7 Issue 4

Nov. 2021

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Lu Yongkui, Wang Baojue, Liu Jixiang. THE INVESTIGATIONS OF THE KINETICS ON INTERMETALLIC COMPOUND GROWTH AT THE INTERFACE OF THE SUBSTRTE COPPER AND TIN OR TIN-LEAD COATING AND THE SOLDERABILITY[J]. Chinese Journal of Engineering, 1985, 7(4): 92-100. doi: 10.13374/j.issn1001-053x.1985.04.011

Citation:

Lu Yongkui, Wang Baojue, Liu Jixiang. THE INVESTIGATIONS OF THE KINETICS ON INTERMETALLIC COMPOUND GROWTH AT THE INTERFACE OF THE SUBSTRTE COPPER AND TIN OR TIN-LEAD COATING AND THE SOLDERABILITY[J]. Chinese Journal of Engineering, 1985, 7(4): 92-100. doi: 10.13374/j.issn1001-053x.1985.04.011

Citation:

Lu Yongkui, Wang Baojue, Liu Jixiang. THE INVESTIGATIONS OF THE KINETICS ON INTERMETALLIC COMPOUND GROWTH AT THE INTERFACE OF THE SUBSTRTE COPPER AND TIN OR TIN-LEAD COATING AND THE SOLDERABILITY[J]. Chinese Journal of Engineering, 1985, 7(4): 92-100. doi: 10.13374/j.issn1001-053x.1985.04.011

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THE INVESTIGATIONS OF THE KINETICS ON INTERMETALLIC COMPOUND GROWTH AT THE INTERFACE OF THE SUBSTRTE COPPER AND TIN OR TIN-LEAD COATING AND THE SOLDERABILITY

doi: 10.13374/j.issn1001-053x.1985.04.011

Available Online: 2021-11-06

Abstract

Abstract

The studies ot copper-tin intertnetallic compounds growth rates at the interface of the copper substrate and tin or lead-64-76% tin coating were conducted in this paper. The thickness of intermetallic compound layers formed with a variety of aging time at 100±1℃ and 155±2℃ had been measued. The dependences of the intermetallic compound thickness on time and temperature were shown. It had experimentally been observed that the growth rate of compound in lead-tin coating at near eute-ctic point is faster than that in purely tin coating. The compound layers have not been detected on the leader which had been stored at room temperature for about a year. In addition, the relationship between the remaining coating and the solderability of leader was also discussed.