Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation
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摘要: 對SnAgCu合金粉末的真空蒸鍍涂層硬脂酸的成膜機理進行了研究.采用掃描電鏡(SEM)和透射電鏡(TEM)對涂覆后合金粉末的形貌及結構進行觀測,采用傅里葉紅外光譜儀(FTIR)和X射線光電子能譜儀(XPS)對涂覆后粉末的透射吸收譜和光電子能量進行測試.結果表明:硬脂酸在合金粉末表面形成一層均勻致密、厚度為5~10 nm的薄膜,硬脂酸涂層SnAgCu合金粉末的行為屬于物理吸附行為,其生長方式遵循島狀生長機理模式,其過程實質是一個氣-固轉換、晶體生長的過程.Abstract: The film-forming mechanism of stearic acid modified SnAgCu alloy powders by vacuum evaporation was researched. Scanning electronic microscope (SEM) and transmission electronic microscope (TEM) were used to observe the morphology and structure of the coated powders. Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) were adopted to test the transmission absorption spectrum and photoelectron energy of the coated powders. The results indicate that uniform and compact coatings whose thickness was 5 to 10 nm could be obtained. The growth mechanism of stearic acid coatings on SnAgCu alloy powders was a process of physical adsorption and followed the Volmer-Weber model. The essence of the process was the transformation between vapor and liquid and the growth of crystals.
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Key words:
- packaging materials /
- electronics packaging /
- powders /
- stearic acid /
- thin films /
- adsorption /
- vacuum evaporation
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