載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響

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載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響

黃繼華, 錢乙余, 姜以宏, 裴佳瑩

文章導航 > 工程科學學報 > 1993 > 15(3): 293-297

黃繼華, 錢乙余, 姜以宏, 裴佳瑩. 載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響[J]. 工程科學學報, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

引用本文:

黃繼華, 錢乙余, 姜以宏, 裴佳瑩. 載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響[J]. 工程科學學報, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

Citation:

Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

黃繼華, 錢乙余, 姜以宏, 裴佳瑩. 載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響[J]. 工程科學學報, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

引用本文:

黃繼華, 錢乙余, 姜以宏, 裴佳瑩. 載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響[J]. 工程科學學報, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

Citation:

Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響

doi: 10.13374/j.issn1001-053x.1993.03.028

1. 北京科技大學;
2. 哈爾濱工業大學;
3. 樺林職工橡膠學院

基金項目:

國家自然科學基金資助項目

作者簡介:
黃繼華,男,30歲,副教授博士

計量
- 文章訪問數: 183
- HTML全文瀏覽量: 60
- PDF下載量: 4
- 被引次數: 0
出版歷程
- 收稿日期: 1992-09-17
- 網絡出版日期: 2021-10-18

The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling

1. Universily of Science and Technology Beijing;
2. Harbin Institute of Technology;
3. Hualin Institute of Rubber Staff

摘要: 研制了一種用于SMT軟釬焊接頭熱循環可靠性試驗的熱循環發生裝置和一種SMT模擬陶瓷芯片載體,用該熱循環裝置、模擬芯片載體和統計學方法研究了芯片載體金屬化鍍層對SMT軟釬焊接頭熱循環可靠性的影響。
- SMT /
- 可靠性 /
- 熱循環 /
- 陶瓷芯片載體 /
- 鍍層
Abstract: An experimental setup and a simulated ceramic chip carrier for study of the SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.
- SMT /
- thermal cycling /
- intermetallics /
- solder joint /
- reliability

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計量

文章訪問數: 183
HTML全文瀏覽量: 60
PDF下載量: 4
被引次數: 0

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