Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies
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摘要: 研究發現,YA-TZP陶瓷材料的性能取決于其顯微結構。當臨界晶粒度約為~0.7μm時,其最佳機械性能為σb=940-1010MPa,K1c=10.9 MPa√m,而且在250℃時效50h無中溫強度衰減。還研究了ZrO2基體中不同相的形貌、顯微裂紋以及第二相質點,并用透射電子顯微鏡發現了位錯網和位錯線。這種YA-TZP陶瓷材料用于拉絲模有良好的應用前景。Abstract: The properties of YA-TZP depend on its microstructures. Optimal combination of mechanical properties with σb =940~1010 MPa and K1c=10.9 MPa√m was obtained as the critical grain size~0,7μm. No strength degradation after aging at 250℃ for 50h. The morphology of different phases in ZrO2, the microcracks and particles of secondary phase wereinvestigated and dislocation networks and lines were found under TEM. Pre-liminary tests show good prospect on application for wire drawing dies.
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Key words:
- YA-TZP ceramic /
- microstructures /
- dislocation /
- wire drawing dies
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